Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15335492Application Date: 2016-10-27
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Publication No.: US10269962B2Publication Date: 2019-04-23
- Inventor: Seung Ryul Lee , Sang Moon Lee , Chul Kim , Ji Eon Yoon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2016-0001537 20160106
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423

Abstract:
A semiconductor device has a fin-type structure which extends in a first direction and includes a laminate of oxide and semiconductor patterns disposed one on another on a first region of a substrate, and a first gate electrode that extends longitudinally in a second direction different from the first direction on the fin-type structure. Each oxide pattern is an oxidized compound containing a first element.
Public/Granted literature
- US20170194479A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-07-06
Information query
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