- 专利标题: Polyamide resin composition
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申请号: US13395535申请日: 2010-09-14
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公开(公告)号: US10273359B2公开(公告)日: 2019-04-30
- 发明人: Shun Ogawa , Hisayuki Kuwahara , Shinichi Ayuba , Takahiko Sumino , Kentaro Ishii
- 申请人: Shun Ogawa , Hisayuki Kuwahara , Shinichi Ayuba , Takahiko Sumino , Kentaro Ishii
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2009-211829 20090914; JP2009-211830 20090914; JP2009-211838 20090914
- 国际申请: PCT/JP2010/065878 WO 20100914
- 国际公布: WO2011/030910 WO 20110317
- 主分类号: C08L77/06
- IPC分类号: C08L77/06 ; C08G69/26
摘要:
Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).
公开/授权文献
- US20120177937A1 POLYAMIDE RESIN COMPOSITION 公开/授权日:2012-07-12
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