Invention Grant
- Patent Title: Package structure for photonic transceiving device
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Application No.: US16013737Application Date: 2018-06-20
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Publication No.: US10274688B2Publication Date: 2019-04-30
- Inventor: Radhakrishnan L. Nagarajan , Peng-Chih Li , Masaki Kato
- Applicant: INPHI CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INPHI CORPORATION
- Current Assignee: INPHI CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Ogawa P.C.
- Agent Richard T. Ogawa
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H04B10/40 ; H04B10/516

Abstract:
A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
Public/Granted literature
- US20180299629A1 PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE Public/Granted day:2018-10-18
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