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公开(公告)号：US11804692B2
公开(公告)日：2023-10-31
申请号：US17191410
申请日：2021-03-03
申请人： INPHI CORPORATION
CPC分类号： H01S5/0264 , H01S5/021 , H01S5/3434
摘要： A laser device based on silicon photonics with an in-cavity power monitor includes a gain chip mounted on a silicon photonics substrate and configured to emit light in an active region bounded between a frontend facet with low reflectivity and a backend facet with anti-reflective characteristics. The laser device further includes a wavelength tuner formed with waveguides in the silicon photonics substrate optically coupled to the backend facet to receive light from the gain chip and configured to have a reflector with high reflectivity to reflect the light in an extended cavity formed with the frontend facet through which a laser with a tuned wavelength and amplified power is outputted. Additionally, the laser device includes a photodiode formed in the silicon photonics substrate and coupled to the waveguides in the extended cavity right in front of the reflector to measure power of light thereof.
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公开(公告)号：US10989937B2
公开(公告)日：2021-04-27
申请号：US16025883
申请日：2018-07-02
申请人： INPHI CORPORATION
摘要： An integrated differential Electro-Absorption Modulator (EAM) device. The device includes a substrate, an electrical driver, and two EAM modules. The electrical driver circuit is configured overlying the substrate member and has one output electrically coupled to the first EAM module and the other output electrically coupled to the second EAM module. The first and second EAM modules have a first and a second output, respectively. A beam splitter can be configured to split an optical input into two optical outputs, each of which can be optically coupled to the optical inputs of the first and second EAM modules.
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公开(公告)号：US10924269B1
公开(公告)日：2021-02-16
申请号：US16053715
申请日：2018-08-02
申请人： INPHI CORPORATION
摘要： A compact optical transceiver formed by hybrid multichip integration. The optical transceiver includes a Si-photonics chip attached on a PCB. Additionally, the optical transceiver includes a first TSV interposer and a second TSV interposer separately attached nearby the Si-photonics chip on the PCB. Furthermore, the optical transceiver includes a driver chip flip-bonded partially on the Si-photonics chip through a first sets of bumps and partially on the first TSV interposer through a second sets of bumps. Moreover, the optical transceiver includes a transimpedance amplifier module chip flip-bonded partially on the Si-photonics chip through a third sets of bumps and partially on the second TSV interposer through a fourth set of bumps.
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公开(公告)号：US10862589B2
公开(公告)日：2020-12-08
申请号：US16828820
申请日：2020-03-24
申请人： INPHI CORPORATION
IPC分类号： H04B10/079 , H04B10/516 , H04B10/40 , H04B10/572 , H04B10/50 , H04L1/20 , H04L1/00
摘要： The present invention is directed to communication systems and methods. In a specific embodiment, the present invention provides an optical receiver that receives a data stream from an optical transmitter. The optical receiver determines a histogram contour parameter using the data stream and inserts the histogram contour parameter into a back-channel data segment, which is then transmitted to the optical transmitter. The optical transmitter changes its data transmission setting based on the histogram contour parameter. There are other embodiments as well.
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公开(公告)号：US10788638B2
公开(公告)日：2020-09-29
申请号：US16245076
申请日：2019-01-10
申请人： INPHI CORPORATION
摘要： A silicon-based edge coupler for coupling a fiber with a waveguide includes a cantilever member being partially suspended with its anchored end coupled to a silicon photonics die in a first part of a silicon substrate and a free end terminated near an edge region separating a second part of the silicon substrate from the first part. The edge coupler further includes a mechanical stopper formed at the edge region with a gap distance ahead of the free end of the cantilever member. Additionally, a V-groove is formed in the second part of the silicon substrate characterized by a top opening and a bottom plane symmetrically connected by two sloped side walls along a fixed Si-crystallography angle. The V-groove is configured to support a fiber with an end facet being pushed against the mechanical stopper and a core center being aligned with the free end of the cantilever member.
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公开(公告)号：US10649951B2
公开(公告)日：2020-05-12
申请号：US16529473
申请日：2019-08-01
申请人： INPHI CORPORATION
IPC分类号： G06F13/24 , H04B10/80 , H04B10/40 , H04B10/556 , H04B10/54 , H04B10/516 , H04B10/69 , H04B14/02 , G06F15/78 , G06F13/42 , G02B6/12 , H04L27/00 , G06F13/364 , G06F13/40 , H04L1/00 , H04L25/03 , H04L5/14 , H04L27/02 , H04L27/18 , H04L27/34
摘要： The present invention includes an integrated system-on-chip device configured on a substrate member. The device has a data input/output interface provided on the substrate member and configured for a predefined data rate and protocol. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The input/output block comprises a SerDes block, a CDR block, a compensation block, and an equalizer block. The SerDes block is configured to convert a first data stream of N having a first predefined data rate at a first clock rate into a second data stream of M having a second predefined data rate at a second clock rate. The device has a driver module provided on the substrate member and coupled to a signal processing block, and a driver interface provided on the substrate member and coupled to the driver module and a silicon photonics device.
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公开(公告)号：US10605999B2
公开(公告)日：2020-03-31
申请号：US16579671
申请日：2019-09-23
申请人： INPHI CORPORATION
IPC分类号： G02B6/42 , H04B10/40 , H04B10/516
摘要： A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
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公开(公告)号：US10466431B2
公开(公告)日：2019-11-05
申请号：US16352054
申请日：2019-03-13
申请人： INPHI CORPORATION
IPC分类号： G02B6/42 , H04B10/40 , H04B10/516
摘要： A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
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公开(公告)号：US10333627B2
公开(公告)日：2019-06-25
申请号：US15633353
申请日：2017-06-26
申请人： INPHI CORPORATION
发明人： Todd Rope , Sung Choi , James Stewart , Radhakrishnan L. Nagarajan , Paul Yu , Ilya Lyubomirsky
IPC分类号： H04B10/69 , H04B10/61 , H04B10/67 , H04L27/18 , G02B6/12 , G02B6/293 , H04B17/20 , H04L27/06
摘要： The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.
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公开(公告)号：US10141717B2
公开(公告)日：2018-11-27
申请号：US15855927
申请日：2017-12-27
摘要： A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
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