- 专利标题： Removable temporary protective layers for use in semiconductor manufacturing
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申请号： US15849988申请日： 2017-12-21
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公开(公告)号： US10276440B2公开(公告)日： 2019-04-30
- 发明人: Desaraju Varaprasad , Ronald R. Katsanes
- 申请人： Honeywell International Inc.
- 申请人地址： US NJ Morris Plains
- 专利权人： Honeywell International Inc.
- 当前专利权人： Honeywell International Inc.
- 当前专利权人地址： US NJ Morris Plains
- 代理机构： Faegre Baker Daniels LLP
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; H01L21/46 ; H01L21/78 ; C09D129/04 ; C09D5/00 ; H01L21/02 ; H01L21/683 ; H01L21/3105
摘要：
A method for temporarily protecting a semiconductor device wafer during processing includes preparing a solution including poly(vinyl alcohol) and water, coating the device wafer with the prepared solution, baking the coated device wafer to form a protective layer, processing the baked device wafer, and dissolving the protective layer from the processed wafer with a solvent at a temperature not less than 65° C. The solvent includes water. The baking is at a temperature from 150° C. to 170° C. The protective layer remains on the baked device wafer during processing. The poly(vinyl alcohol) has a degree of hydrolysis greater than or equal to 93%.
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