Invention Grant
- Patent Title: Cabinet and heat dissipation system
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Application No.: US15785159Application Date: 2017-10-16
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Publication No.: US10278309B2Publication Date: 2019-04-30
- Inventor: Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Priority: CN201510185495 20150417
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.
Public/Granted literature
- US20180042141A1 Cabinet and Heat Dissipation System Public/Granted day:2018-02-08
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