Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US15213962Application Date: 2016-07-19
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Publication No.: US10283247B2Publication Date: 2019-05-07
- Inventor: Yuusuke Nagai , Masazumi Arata , Kenji Komorita , Yoshimitsu Satoh
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-146575 20150724
- Main IPC: H01F17/00
- IPC: H01F17/00

Abstract:
In a multilayer coil component, even when both pairs of ends of a first coil part and a second coil part are located at the same positions when viewed from the laminated direction and have the same shapes, a connecting part is connected only to a second end of the first coil part on the upper side in the laminated direction, and is connected only to a first end of the second coil part on the lower side in the laminated direction. Thus, a coil wound around along the laminated direction is structured without misaligning the positions of respective connecting parts. Consequently, the entire shapes of the respective coil parts can be designed to be the exact same shape, which makes it possible to reduce the number of types of coil part, saving labor and time for preparing many types of conductor patterns like the conventional type.
Public/Granted literature
- US20170025219A1 MULTILAYER COIL COMPONENT Public/Granted day:2017-01-26
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |