Invention Grant
- Patent Title: Power electronics module with first and second coolers
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Application No.: US15783193Application Date: 2017-10-13
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Publication No.: US10283436B2Publication Date: 2019-05-07
- Inventor: Juergen Schuderer , Fabian Mohn , Didier Cottet , Felix Traub , Daniel Kearney
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Taft Stettinius & Hollister LLP
- Agent J. Bruce Schelkopf
- Priority: EP15163368 20150413
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L25/07 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L29/16

Abstract:
A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips are at least partially embedded onto the insulation material.
Public/Granted literature
- US20180040538A1 POWER ELECTRONICS MODULE Public/Granted day:2018-02-08
Information query
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