Invention Grant
- Patent Title: High electron mobility transistor structure and method of making the same
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Application No.: US15670135Application Date: 2017-08-07
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Publication No.: US10283599B2Publication Date: 2019-05-07
- Inventor: Fu-Wei Yao , Chun-Wei Hsu , Chen-Ju Yu , Jiun-Lei Jerry Yu , Fu-Chih Yang , Chih-Wen Hsiung , King-Yuen Wong
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/40 ; H01L29/66 ; H01L29/778

Abstract:
A transistor includes a first layer over a substrate. The transistor also includes a second layer over the first layer. The transistor further includes a carrier channel layer at an interface of the first layer and the second layer. The transistor additionally includes a gate structure, a drain, and a source over the second layer. The transistor also includes a passivation material in the second layer between an edge of the gate structure and an edge of the drain in a top-side view. The carrier channel layer has a smaller surface area than the first layer between the edge of the gate structure and the edge of the drain in the top-side view.
Public/Granted literature
- US20170338316A1 High Electron Mobility Transistor Structure and Method of Making the Same Public/Granted day:2017-11-23
Information query
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