Invention Grant
- Patent Title: Substrate processing apparatus, gas supply method, substrate processing method, and film forming method
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Application No.: US15468563Application Date: 2017-03-24
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Publication No.: US10287682B2Publication Date: 2019-05-14
- Inventor: Kazuyuki Kikuchi , Tsuneyuki Okabe , Kohei Fukushima
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2016-063723 20160328
- Main IPC: C23C16/455
- IPC: C23C16/455

Abstract:
A substrate processing apparatus includes: a process container configured to receive a substrate therein; a pressure detection part configured to measure an internal pressure of the process container; an exhaust-side valve installed in an exhaust pipe configured to exhaust an interior of the process container; a gas storage tank connected to the process container through a first gas supply pipe; a gas amount measuring part configured to measure an amount of gas stored in the gas storage tank; and a control valve installed in the first gas supply pipe and configured to control the internal pressure of the process container by changing an opening degree of the control valve based on the internal pressure of the process container which is detected by the pressure detection part and by controlling a flow path cross section through which the gas is supplied from the gas storage tank to the process container.
Public/Granted literature
- US20170275757A1 Substrate Processing Apparatus, Gas Supply Method, Substrate Processing Method, and Film Forming Method Public/Granted day:2017-09-28
Information query
IPC分类: