- Patent Title: Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput
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Application No.: US14209198Application Date: 2014-03-13
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Publication No.: US10290088B2Publication Date: 2019-05-14
- Inventor: Himanshu Vajaria , Tommaso Torelli , Bradley Ries , Mohan Mahadevan
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G06T7/00
- IPC: G06T7/00 ; H01L21/66
Abstract:
Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.
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