Invention Grant
- Patent Title: Conductive pillar shaped for solder confinement
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Application No.: US15829492Application Date: 2017-12-01
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Publication No.: US10290599B2Publication Date: 2019-05-14
- Inventor: Charles L. Arvin , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Steven Laut
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method of fabricating a pillar-type connection includes forming a second conductive layer on a first conductive layer to define a conductive pillar that includes a non-planar top surface defining a recess aligned with a hollow core of the first conductive layer.
Public/Granted literature
- US20180102337A1 CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT Public/Granted day:2018-04-12
Information query
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