Invention Grant
- Patent Title: Chip on leadframe optical subassembly
-
Application No.: US15644494Application Date: 2017-07-07
-
Publication No.: US10295768B2Publication Date: 2019-05-21
- Inventor: Wendy Pei Fen Lau , Paul Thien Vui Chia , Yunpeng Song , Tat Ming Teo , Yew-Tai Chieng
- Applicant: Finisar Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: G02B6/42
- IPC: G02B6/42
Abstract:
One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.
Public/Granted literature
- US20180011267A1 CHIP ON LEADFRAME OPTICAL SUBASSEMBLY Public/Granted day:2018-01-11
Information query
