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    Optoelectronic subassembly with components mounted on top and bottom of substrate
    1.
    发明授权
    Optoelectronic subassembly with components mounted on top and bottom of substrate 有权

    公开(公告)号：US10342141B2

    公开(公告)日：2019-07-02

    申请号：US15847798

    申请日：2017-12-19

    Applicant: FINISAR CORPORATION

    Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

    IPC: H05K3/32 ,  H05K1/18 ,  G02B6/00 ,  G02B6/42 ,  H05K1/02 ,  H05K1/11

    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

    3-D integrated package
    2.
    发明授权
    3-D integrated package 有权
    3-D集成包装

    公开(公告)号：US09437912B2

    公开(公告)日：2016-09-06

    申请号：US14691552

    申请日：2015-04-20

    Applicant: FINISAR CORPORATION

    Inventor： Yunpeng Song ,  Yongsheng Liu ,  Hongyu Deng

    IPC: H01P1/04 ,  H01P3/00 ,  H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H01P5/08

    CPC classification number: H01P5/08 ,  H01P1/047 ,  H01P3/003 ,  H01P3/08 ,  H05K1/0227 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/112 ,  H05K2201/09236

    Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

    Abstract translation: 在示例性实施例中，电子封装包括一个或多个绝缘层和导电传输线。 导电传输线包括基本上平行于一个或多个绝缘层设置的信号迹线。 导电传输线还包括电耦合到信号迹线的一个或多个信号通孔。 一个或多个信号通孔被配置成穿过一个或多个绝缘层的至少一部分。 电子封装还包括基本上平行于一个或多个绝缘层的一个或多个导电接地平面。 地平面包括一个或多个通过地面切割的信号。 通过接地切口的一个或多个信号在一个或多个信号通孔和一个或多个接地平面之间提供间隙。

    SUBSTRATES INCLUDING OPTOELECTRONIC COMPONENTS
    4.
    发明申请
    SUBSTRATES INCLUDING OPTOELECTRONIC COMPONENTS 有权
    基板包括光电元件

    公开(公告)号：US20160050775A1

    公开(公告)日：2016-02-18

    申请号：US14923037

    申请日：2015-10-26

    Applicant: FINISAR CORPORATION

    Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

    IPC: H05K5/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/32 ,  G02B6/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611

    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

    Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与头部组件和/或光电子部件有关的装置和方法。 在一些方面，所公开的设备和方法可以涉及头部子组件，其可以包括：具有衬底顶部和衬底底部的衬底; 至少一个光电转换器在衬底顶部; 所述衬底顶部上的至少一个顶部电气部件，所述电气部件可以与所述光电转换器可操作地耦合; 以及衬底底部上的至少一个底部电气部件，底部电气部件可以与光电转换器可操作地耦合。

    OPTICAL TRANSMITTERS
    6.
    发明申请
    OPTICAL TRANSMITTERS 有权
    光传输器

    公开(公告)号：US20160277140A1

    公开(公告)日：2016-09-22

    申请号：US15046436

    申请日：2016-02-17

    Applicant: Finisar Corporation

    Inventor： Tao Wu ,  Hongyu Deng ,  Maziar Amirkiai ,  Shanshan Zeng ,  Tengda Du ,  Yunpeng Song

    IPC: H04J14/06 ,  H04J14/02

    CPC classification number: H04J14/06 ,  H01S5/0064 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/4012 ,  H01S5/4087 ,  H04B10/506 ,  H04J14/0221

    Abstract: An optical transmitter may include a transmit laser assembly configured to emit multiple light beams. The optical transmitter may additionally include an isolator configured to rotate a corresponding polarization state of each of the multiple light beams. The optical transmitter may additionally include a power multiplexing combiner configured to receive the multiple light beams from the isolator and combine the multiple light beams into a combined light beam. The optical transmitter may additionally include a lens configured to focus the combined light beam onto an optical fiber for transmission.

    Abstract translation: 光发射机可以包括被配置为发射多个光束的发射激光器组件。 光发射机可以另外包括隔离器，其被配置为旋转多个光束中的每一个的对应的偏振状态。 光发射机可以另外包括功率复用组合器，其被配置为从隔离器接收多个光束并将多个光束组合成组合光束。 光发射机可以另外包括配置成将组合的光束聚焦到光纤上用于透射的透镜。

    MULTI-LAYER SUBSTRATES
    7.
    发明申请
    MULTI-LAYER SUBSTRATES 有权
    多层基板

    公开(公告)号：US20160050751A1

    公开(公告)日：2016-02-18

    申请号：US14923034

    申请日：2015-10-26

    Applicant: FINISAR CORPORATION

    Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Hongyu Deng

    IPC: H05K1/02 ,  H05K3/30 ,  H05K3/18 ,  H05K1/18 ,  H05K3/12

    CPC classification number: H05K3/4682 ,  H05K1/0242 ,  H05K1/113 ,  H05K3/303 ,  H05K3/4667 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10121

    Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

    Abstract translation: 本公开通常涉及使用光信号通过网络传输数据的高速光纤网络。 所公开的主题包括与头部组件和/或光电子部件有关的装置和方法。 在一些方面，所公开的设备和方法可以涉及头部子组件，其可以包括：具有底层的多层衬底，具有顶部薄膜信号线的顶层，以及具有位于第一层之间的厚膜迹线的一个或多个中间层 顶层和底层，厚膜迹线电耦合到顶部薄膜信号线; 以及位于多层衬底上并与信号线电耦合的光电子部件。

    Transmission lines
    9.
    发明授权
    Transmission lines 有权

    公开(公告)号：US09686856B2

    公开(公告)日：2017-06-20

    申请号：US14243757

    申请日：2014-04-02

    Applicant: Finisar Corporation

    Inventor： Yunpeng Song ,  Hongyu Deng ,  Mark Donovan

    IPC: H05K7/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H01P5/02 ,  H05K1/00

    CPC classification number: H05K1/0243 ,  H01P5/028 ,  H05K1/0239 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/18 ,  H05K3/222 ,  H05K3/4685 ,  Y10T29/49155

    Abstract: A circuit may include a first transmission line that includes a first first-line conductor configured to transport a signal and a second first-line conductor. The circuit may also include a second transmission line that includes a first second-line conductor, a second second-line conductor electrically coupled to the second first-line conductor, and a third second-line conductor separated from and positioned between the first and second second-line conductors. The third second-line conductor may be electrically coupled to the first first-line conductor. The circuit may also include a conductive jumper electrically coupling the first and second second-line conductors. The conductive jumper may contact the first and second second-line conductors in a position near the coupling of the first and second transmission lines.

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