Invention Grant
- Patent Title: Fingerprint recognition apparatus
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Application No.: US15512278Application Date: 2014-09-18
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Publication No.: US10296774B2Publication Date: 2019-05-21
- Inventor: Xu Peng , Jianglin Gu , Bo Huang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- International Application: PCT/CN2014/086844 WO 20140918
- International Announcement: WO2016/041174 WO 20160324
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06F21/32 ; H04L9/32

Abstract:
Embodiments of the present invention provide a fingerprint recognition apparatus. The finger recognition apparatus includes a conductive housing. Additionally, the finger recognition apparatus includes a conductor frame, configured to transmit a radio frequency signal. The fingerprint recognition apparatus also includes an insulation layer, disposed between the conductor frame and the conductive housing.
Public/Granted literature
- US20170277932A1 Fingerprint Recognition Apparatus Public/Granted day:2017-09-28
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