Invention Grant
- Patent Title: Method of making thin SRAM cell having vertical transistors
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Application No.: US15810654Application Date: 2017-11-13
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Publication No.: US10297512B2Publication Date: 2019-05-21
- Inventor: Karthik Balakrishnan , Michael A. Guillorn , Pouya Hashemi , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Harrington & Smith
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8238 ; H01L27/11 ; H01L29/06 ; H01L27/06 ; H01L29/786 ; H01L21/84 ; H01L21/02 ; B82Y10/00 ; H01L29/417 ; H01L29/41 ; H01L29/775

Abstract:
A memory device includes six field effect transistors (FETs) formed with semiconductor nanowires arranged on a substrate in an orientation substantially perpendicular to the substrate. The semiconductor nanowires have bottom contacts, gate contacts separated in a direction perpendicular to the substrate from the bottom contacts, and top contacts separated in a direction perpendicular to the substrate from the gate contacts. The necessary connections are made among the bottom, gate, and top contacts to form the memory device using first, second, and third metallization layers, the first metallization layer being separated in a direction perpendicular to the substrate from the top contacts, the second metallization layer being separated in a direction perpendicular to the substrate from the first metallization layer, and the third metallization layer being separated in a direction perpendicular to the substrate from the second metallization layer. Vias connect the various contacts to the overlying metallization layers as necessary. A method for forming the memory device is also outlined.
Public/Granted literature
- US20180069013A1 Thin SRAM Cell Having Vertical Transistors Public/Granted day:2018-03-08
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