Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15956287Application Date: 2018-04-18
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Publication No.: US10297600B2Publication Date: 2019-05-21
- Inventor: Se-hyoung Ahn , Youn-soo Kim , Jae-hyoung Choi , Jae-wan Chang , Sun-min Moon , Jin-sun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2016-0068846 20160602
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/108 ; H01L49/02

Abstract:
A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
Public/Granted literature
- US20180240800A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-08-23
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