Invention Grant
- Patent Title: Composite flexible printed wiring board and method for manufacturing composite flexible printed wiring board
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Application No.: US16049861Application Date: 2018-07-31
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Publication No.: US10297937B2Publication Date: 2019-05-21
- Inventor: Takahisa Hirasawa , Takayuki Furuno
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-148212 20170731
- Main IPC: H01R12/61
- IPC: H01R12/61 ; H05K1/14 ; H01R4/62 ; H01R43/02 ; H05K3/00 ; H05K3/36 ; H01R43/20
Abstract:
A composite flexible printed wiring board includes a first flexible printed wiring board having an insulating layer, conductor layers and a first metal block fitted in a hole penetrating through the conductor layers and insulating layer, and a second flexible printed wiring board having an insulating layer, conductor layers and a second metal block fitted in a hole penetrating through the conductor layers and insulating layer. The first flexible printed wiring board and the second flexible printed wiring board have a welded portion formed by welding the first metal block and the second metal block and joining the first metal block and the second metal block such that the welded portion is joining the first flexible printed wiring board and the second flexible printed wiring board.
Public/Granted literature
Information query
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