The disclosed heatsink apparatus may include (i) a base that facilitates thermal transfer between a computing component and cooling airflow, (ii) a plurality of fins, extending from the base, that provide additional surface area to facilitate the thermal transfer between the computing component and the cooling airflow, (iii) at least one channel, defined within the plurality of fins, that facilitates a faster passage of a portion of the cooling airflow across the heatsink apparatus and (iv) at least one air dam that prevents the cooling airflow from escaping a designated path on a printed circuit board. Various other apparatuses, systems, and methods are also disclosed.