Invention Grant
- Patent Title: Mounted structure of laminated capacitor, and method of mounting laminated capacitor
-
Application No.: US15586312Application Date: 2017-05-04
-
Publication No.: US10299369B2Publication Date: 2019-05-21
- Inventor: Yasuo Fujii , Hiroaki Hori
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-096630 20160513
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H01G4/012 ; H01G4/248 ; H01G4/30 ; H03H7/38 ; H05K1/11 ; H05K1/18 ; H05K3/30 ; H01G4/35 ; H01G4/40 ; H01G2/06 ; H01G4/232
Abstract:
A wiring board is provided with power supply patterns for each type of power supply of an IC. An IC has a plurality of power supply terminals for each type of power supply. For each type of power supply, two or more laminated capacitors are provided in parallel between the power supply of IC and a ground. Two or more laminated capacitors provided for each type of power supply include a laminated capacitor having a Q factor of less than about 0.5. For each type of power supply, in order to satisfy a target impedance, two or more laminated capacitors are arranged and distributed such that at least half of the plurality of power supply terminals are included in a region obtained by combining cover areas.
Public/Granted literature
- US20170332483A1 MOUNTED STRUCTURE OF LAMINATED CAPACITOR, AND METHOD OF MOUNTING LAMINATED CAPACITOR Public/Granted day:2017-11-16
Information query
