- Patent Title: Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object
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Application No.: US15098679Application Date: 2016-04-14
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Publication No.: US10299376B2Publication Date: 2019-05-21
- Inventor: Hidefumi Nakamura , Taku Kawasaki
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2015-086199 20150420
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H01B19/00 ; H05K3/22 ; H03H9/10 ; H01B1/22 ; B22F1/02 ; B22F3/02 ; H05K3/10 ; H05K3/40 ; H05K3/12
Abstract:
A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.
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