An illumination assembly configured to emit diffuse light through an indicator is disclosed. The assembly comprises a substrate having an applique disposed thereon. The applique forms an opening configured to transmit light through the substrate. The assembly further comprises a light source in connection with a circuit and configured to emit light through the shape. A diffusing layer is applied to a surface of the assembly between the circuit and the substrate. The diffusing layer comprises a resin material configured to cure in response to exposure to ultraviolet light or heat. The diffusing layer further comprises a filler material comprising a plurality of beaded structures configured to diffuse light from the light source.