Invention Grant
- Patent Title: Spectrometer module and fabrication method thereof
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Application No.: US15371229Application Date: 2016-12-07
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Publication No.: US10302486B2Publication Date: 2019-05-28
- Inventor: Chien-Hsiang Hung
- Applicant: OTO PHOTONICS INC.
- Applicant Address: TW Hsinchu
- Assignee: OTO PHOTONICS INC.
- Current Assignee: OTO PHOTONICS INC.
- Current Assignee Address: TW Hsinchu
- Agent Cheng-Ju Chiang
- Priority: TW105121955A 20160712
- Main IPC: G01J3/02
- IPC: G01J3/02 ; G01J3/18

Abstract:
A spectrometer module and a fabrication method thereof are provided. The fabrication method includes the steps of: providing at least one substrate; and forming at least one positioning side and at least one optical component of the spectrometer on the at least one substrate by a microelectromechanical systems (MEMS) process. The spectrometer module fabricated by the fabrication method includes a plurality of substrates and at least one optical component. At least one of the substrates has at least one positioning side, and the at least one optical component of the spectrometer is formed on at least one of the substrates. The positioning side and the optical component are fabricated by a MEMS process.
Public/Granted literature
- US20180017441A1 SPECTROMETER MODULE AND FABRICATION METHOD THEREOF Public/Granted day:2018-01-18
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