Invention Grant
- Patent Title: On-die temperature sensing and digitization system
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Application No.: US15418544Application Date: 2017-01-27
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Publication No.: US10302504B1Publication Date: 2019-05-28
- Inventor: Suresh P. Parameswaran , Boon Y. Ang , Ankur Jain
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent LeRoy D. Maunu
- Main IPC: G01K7/01
- IPC: G01K7/01 ; G01K7/16 ; G01K15/00

Abstract:
The disclosure provides simple, low-cost but accurate systems and related methods for on-die temperature sensing typically using calibration and without the need for precision voltage references. In some implementations, the system utilizes two user selectable temperature sensing elements and two user selectable DACs to provide a digital code for the sensed temperature. In some implementations, the two sensing elements can be used to calibrate against each other. For example, calibration can be useful to account for silicon local/global variation. Typically, one of the temperature sensors is diode-based, while the other is resistor-based. However, those of skill in the art will recognize that, in accordance with the disclosure, more than two sensors can be provided that can be calibrated against one another.
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