Invention Grant
- Patent Title: Producing wafer level packaging using leadframe strip and related device
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Application No.: US15858673Application Date: 2017-12-29
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Publication No.: US10304763B2Publication Date: 2019-05-28
- Inventor: Richard S. Graf , Sudeep Mandal , Kibby Horsford
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L25/065 ; H01L23/31 ; H01L23/498 ; H01L23/538 ; H01L25/10
Abstract:
A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.
Public/Granted literature
- US20180122730A1 PRODUCING WAFER LEVEL PACKAGING USING LEADFRAME STRIP AND RELATED DEVICE Public/Granted day:2018-05-03
Information query
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