公开(公告)号：US10304763B2

公开(公告)日：2019-05-28

申请号：US15858673

申请日：2017-12-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Richard S. Graf ,  Sudeep Mandal ,  Kibby Horsford

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10

Abstract: A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.

公开(公告)号：US09892999B2

公开(公告)日：2018-02-13

申请号：US15175290

申请日：2016-06-07

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Richard S. Graf ,  Sudeep Mandal ,  Kibby Horsford

IPC: H01L21/78 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49575 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49586 ,  H01L23/49816 ,  H01L23/49861 ,  H01L23/49866 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311

Abstract: A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.