Invention Grant
- Patent Title: Three-dimensional molding method
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Application No.: US16045028Application Date: 2018-07-25
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Publication No.: US10307964B2Publication Date: 2019-06-04
- Inventor: Kazuyuki Morishita , Yuya Matsuda , Tetsushi Midorikawa
- Applicant: Fukui Prefectural Government , Matsuura Machinery Corporation
- Applicant Address: JP Fukui, Fukui JP Fukui, Fukui
- Assignee: Fukui Prefectural Government,Matsuura Machinery Corporation
- Current Assignee: Fukui Prefectural Government,Matsuura Machinery Corporation
- Current Assignee Address: JP Fukui, Fukui JP Fukui, Fukui
- Agent Richard M. Goldberg
- Priority: JP2017-148397 20170731
- Main IPC: B29C41/02
- IPC: B29C41/02 ; B29C64/40 ; B29C33/44 ; B33Y10/00 ; B29C64/153 ; B22F3/105 ; B29K105/00

Abstract:
A three-dimensional molding method in which a step of sintering a powder layer with a laser light or an electron beam after a flat surface has been formed by sliding of a squeegee against the powder layer is repeated in a prescribed number of times, and then the periphery is cut, in order to mold both the object 1 to be molded and a support structure 2 that supports the lower side of the object 1 from below and is intended to be removed after molding, wherein in the support structure 2, the upper parts of the struts connected to the object 1 to be molded employ truncated circular conic shapes or partial truncated circular conic shapes that are reduced in diameter toward the top.
Public/Granted literature
- US20190030825A1 THREE-DIMENSIONAL MOLDING METHOD Public/Granted day:2019-01-31
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