Invention Grant
- Patent Title: Hierarchical micro assembler system
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Application No.: US15476843Application Date: 2017-03-31
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Publication No.: US10308504B2Publication Date: 2019-06-04
- Inventor: Jeng Ping Lu , Eugene M. Chow , David K. Biegelsen , Sourobh Raychaudhuri
- Applicant: Palo Alto Research Center Incorporated
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Agency: Womble Bond Dickinson (US) LLP
- Agent Daniel E. Ovanezian
- Main IPC: H01L21/06
- IPC: H01L21/06 ; B81C1/00 ; B82Y30/00 ; B82Y40/00 ; H01L21/027 ; H01L29/06

Abstract:
A method of manufacturing and using micro assembler systems are described. A method of manufacturing includes disposing a first plurality of electrodes above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The method further includes disposing a second plurality of electrodes above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing. A method of using micro assembler systems includes disposing a mobile particle at least partially submersed in an assembly medium above a substrate, a first plurality of electrodes and a second plurality of electrodes. The method further includes conducting a field through individual electrodes of the first plurality of electrodes and the second plurality of electrodes to generate electrophoretic forces or dielectrophoretic forces on the mobile particle.
Public/Granted literature
- US20180282151A1 HIERARCHICAL MICRO ASSEMBLER SYSTEM Public/Granted day:2018-10-04
Information query
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