- 专利标题: Stacked dies and dummy components for improved thermal performance
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申请号: US15844575申请日: 2017-12-17
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公开(公告)号: US10312221B1公开(公告)日: 2019-06-04
- 发明人: Rahul Agarwal , Kaushik Mysore Srinivasa Setty , Milind S. Bhagavat , Brett P. Wilkerson
- 申请人: Rahul Agarwal , Kaushik Mysore Srinivasa Setty , Milind S. Bhagavat , Brett P. Wilkerson
- 申请人地址: US CA Santa Clara
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理商 Timothy M. Honeycutt
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L25/065 ; H01L23/538 ; H01L23/498 ; H01L23/00
摘要:
Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device includes a stack of plural semiconductor chips. Each two adjacent semiconductor chips of the plural semiconductor chips is electrically connected by plural interconnects and physically connected by a first insulating bonding layer. A first stack of dummy chips is positioned opposite a first side of the stack of semiconductor chips and separated from the plural semiconductor chips by a first gap. Each two adjacent of the first dummy chips are physically connected by a second insulating bonding layer. A second stack of dummy chips is positioned opposite a second side of the stack of semiconductor chips and separated from the plural semiconductor chips by a second gap. Each two adjacent of the second dummy chips are physically connected by a third insulating bonding layer. The first, second and third insulating bonding layers include a first insulating layer and a second insulating layer bonded to the first insulating layer. An insulating layer is in the first gap and another insulating layer is in the second gap.