Invention Grant
- Patent Title: Thermal bypass valve
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Application No.: US15587801Application Date: 2017-05-05
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Publication No.: US10317918B2Publication Date: 2019-06-11
- Inventor: Xiujie Gao , Kevin B. Rober , Marco A. Lopes , Nancy L. Johnson , Anthony L. Smith , Nicholas W. Pinto , Richard J. Skurkis , Tyler P. Ownby
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC , DYNALLOY, INC.
- Applicant Address: US MI Detroit US CA Tustin
- Assignee: GM Global Technology Operations LLC.,Dynalloy, Inc.
- Current Assignee: GM Global Technology Operations LLC.,Dynalloy, Inc.
- Current Assignee Address: US MI Detroit US CA Tustin
- Agency: Quinn IP Law
- Main IPC: F16K31/00
- IPC: F16K31/00 ; G05D23/13 ; G05D23/185

Abstract:
A thermal bypass valve includes a housing defining a bore along a longitudinal axis and having two inlet ports and two outlet ports; a cap disposed within the bore; a shuttle disposed within the bore and reversibly translatable towards and away from the cap along the longitudinal axis between a first fill position, a cooling position, and a bypass position; and an actuator configured for translating the shuttle along the longitudinal axis between the cooling position and the bypass position. The actuator is formed from a shape memory alloy and is transitionable between a first state and a second state in response to a temperature of the fluid.
Public/Granted literature
- US20170344036A1 THERMAL BYPASS VALVE Public/Granted day:2017-11-30
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