- Patent Title: Method and apparatus for processing semiconductor device structures
-
Application No.: US15680461Application Date: 2017-08-18
-
Publication No.: US10326044B2Publication Date: 2019-06-18
- Inventor: Andrew M. Bayless
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/40 ; H01L33/00 ; H01L21/78 ; H01L23/538
Abstract:
A method of processing a device wafer comprising applying a sacrificial material to a surface of a carrier wafer, adhering a surface of the device wafer to an opposing surface of the carrier wafer, planarizing an exposed surface of the sacrificial material by removing only a portion of a thickness thereof, and planarizing an opposing surface of the device wafer. A wafer assembly is also disclosed.
Public/Granted literature
- US20190057901A1 METHOD AND APPARATUS FOR PROCESSING SEMICONDUCTOR DEVICE STRUCTURES Public/Granted day:2019-02-21
Information query
IPC分类:
