Invention Grant
- Patent Title: Electric assembly including a semiconductor switching device and a clamping diode
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Application No.: US15331548Application Date: 2016-10-21
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Publication No.: US10333387B2Publication Date: 2019-06-25
- Inventor: Thomas Basler , Roman Baburske , Johannes Georg Laven
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Techonologies AG
- Current Assignee: Infineon Techonologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015118165 20151023
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H02M1/32 ; H01L23/60 ; H01L25/18 ; H01L29/06 ; H01L29/16 ; H01L29/739 ; H01L29/868 ; H01L29/872 ; H01L29/861 ; H03K17/0814 ; H03K17/12 ; H03K17/74
Abstract:
An electric assembly includes a semiconductor switching device with a maximum breakdown voltage rating across two load terminals in an off-state. A clamping diode is electrically connected to the two load terminals and parallel to the switching device. A semiconductor body of the clamping diode is made of silicon carbide. An avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device.
Public/Granted literature
- US20170117798A1 Electric Assembly Including a Semiconductor Switching Device and a Clamping Diode Public/Granted day:2017-04-27
Information query
