Invention Grant
- Patent Title: High tolerance connection between elements
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Application No.: US15821301Application Date: 2017-11-22
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Publication No.: US10334745B2Publication Date: 2019-06-25
- Inventor: Scott A. Myers , Mattia Pascolini , Richard Hung Minh Dinh , Trent Weber , Robert Schlub , Josh Nickel , Robert Hill , Nanbo Jin , Tang Yew Tan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/42 ; H05K5/02

Abstract:
An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.
Public/Granted literature
- US20190132977A1 HIGH TOLERANCE CONNECTION BETWEEN ELEMENTS Public/Granted day:2019-05-02
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