SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES

    公开(公告)号:US20210191458A1

    公开(公告)日:2021-06-24

    申请号:US17192722

    申请日:2021-03-04

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

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