Invention Grant
- Patent Title: Microwire array devices and methods for fabricating polymeric sheets containing microwires
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Application No.: US15199309Application Date: 2016-06-30
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Publication No.: US10336017B2Publication Date: 2019-07-02
- Inventor: John J. Vajo , Shanying Cui , Adam F. Gross
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: Boeing Company, the
- Current Assignee: Boeing Company, the
- Current Assignee Address: US IL Chicago
- Agency: Parsons Behle & Latimer
- Main IPC: B29C70/62
- IPC: B29C70/62 ; B29C70/82 ; B29C70/88 ; B29C70/72 ; B29C70/68 ; H05K9/00 ; H01F1/00

Abstract:
A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.
Public/Granted literature
- US20180007819A1 Microwire Array Devices and Methods for Fabricating Polymeric Sheets Containing Microwires Public/Granted day:2018-01-04
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