- 专利标题: Microwire array devices and methods for fabricating polymeric sheets containing microwires
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申请号: US15199309申请日: 2016-06-30
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公开(公告)号: US10336017B2公开(公告)日: 2019-07-02
- 发明人: John J. Vajo , Shanying Cui , Adam F. Gross
- 申请人: The Boeing Company
- 申请人地址: US IL Chicago
- 专利权人: Boeing Company, the
- 当前专利权人: Boeing Company, the
- 当前专利权人地址: US IL Chicago
- 代理机构: Parsons Behle & Latimer
- 主分类号: B29C70/62
- IPC分类号: B29C70/62 ; B29C70/82 ; B29C70/88 ; B29C70/72 ; B29C70/68 ; H05K9/00 ; H01F1/00
摘要:
A method for fabricating polymeric sheets containing microwires includes encapsulating at least a portion of individual lengths of a plurality of microwires in a non-conductive polymeric sheet while the microwires are attached to the substrate. The microwires are then detached from the substrate without removing the microwires from the polymeric sheet. The detaching step forms a separated polymeric sheet containing the detached microwires. Individual detached microwires of the plurality are approximately perpendicular to the separated polymeric sheet. A microwire array device includes a non-conductive polymeric sheet and a plurality of microwires. Individual microwires of the plurality have an independent length at least partially encapsulated by the polymeric sheet, are approximately perpendicular to the polymeric sheet, and contain magnetic ferrite.
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