Invention Grant
- Patent Title: Ruggedized photonic crystal sensor packaging
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Application No.: US15957784Application Date: 2018-04-19
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Publication No.: US10338328B2Publication Date: 2019-07-02
- Inventor: Michael A. Carralero , Eric Y. Chan , Dennis G. Koshinz
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Haynes and Boone LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/36 ; G02B6/122 ; G01D5/26 ; G02B6/24 ; G02B6/30 ; G01D11/24 ; G01F23/292

Abstract:
A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.
Public/Granted literature
- US20180246285A1 RUGGEDIZED PHOTONIC CRYSTAL SENSOR PACKAGING Public/Granted day:2018-08-30
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