Invention Grant
- Patent Title: Substrate mounting method and substrate mounting device
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Application No.: US15660622Application Date: 2017-07-26
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Publication No.: US10340176B2Publication Date: 2019-07-02
- Inventor: Toshiaki Fujisato , Hiroaki Ashizawa , Taichi Monden , Yasushi Fujii , Yu Nunoshige
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2016-154382 20160805
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/677

Abstract:
There is provided a substrate mounting method of bringing a substrate close to a mounting table to mount the substrate on the mounting table by reducing a protrusion amount of a plurality of projections configured to protrude from a substrate-mounting surface of the mounting table and to support the substrate, the protrusion amount being defined to protrude from the substrate-mounting surface. The method includes: after at least a portion of the substrate is brought into contact with the substrate-mounting surface, halting an operation of bringing the substrate close to the mounting table; and after the halting the operation of bringing the substrate close to the mounting table, resuming the operation of bringing the substrate close to the mounting table.
Public/Granted literature
- US20180040503A1 SUBSTRATE MOUNTING METHOD AND SUBSTRATE MOUNTING DEVICE Public/Granted day:2018-02-08
Information query
IPC分类: