Invention Grant
- Patent Title: Chip part and manufacturing method thereof
-
Application No.: US15670627Application Date: 2017-08-07
-
Publication No.: US10342138B2Publication Date: 2019-07-02
- Inventor: Yasuhiro Kondo , Katsuya Matsuura , Hiroshi Tamagawa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2016-155914 20160808
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H05K3/00 ; H01L21/71 ; H01L21/78 ; H05K3/04 ; B23K1/005 ; H05K13/02 ; H01L23/66 ; H01L23/00 ; H01L21/683 ; H05K1/02 ; H01L21/66
Abstract:
A chip part includes a substrate having a first main surface on one side thereof and a second main surface on the other side thereof, a functional device famed at a first main surface side of the substrate, an external terminal formed at the first main surface side of the substrate and electrically connected to the functional device, and a light diffusion reflection structure formed at a second main surface side of the substrate and diffusely reflecting light irradiated toward the second main surface of the substrate.
Public/Granted literature
- US20180042118A1 CHIP PART AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-02-08
Information query
IPC分类:
