- 专利标题： Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same
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申请号： US15468066申请日： 2017-03-23
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公开(公告)号： US10343897B2公开(公告)日： 2019-07-09
- 发明人: Julius Ming-Lin Tsai , Baris Cagdaser , Martin Lim , Aleksey S. Khenkin
- 申请人： INVENSENSE, Inc.
- 申请人地址： US CA San Jose
- 专利权人： INVENSENSE, INC.
- 当前专利权人： INVENSENSE, INC.
- 当前专利权人地址： US CA San Jose
- 代理机构： Amin, Turocy & Watson, LLP
- 主分类号： B81B7/02
- IPC分类号： B81B7/02 ; B81C1/00 ; H04R1/04 ; H04R29/00 ; H04R19/04
摘要：
An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.