Invention Grant
- Patent Title: Boundary scan chain for stacked memory
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Application No.: US15293123Application Date: 2016-10-13
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Publication No.: US10347354B2Publication Date: 2019-07-09
- Inventor: David J. Zimmerman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G11C5/04
- IPC: G11C5/04 ; G11C29/32 ; G11C11/408 ; G01R31/3177 ; G01R31/3185

Abstract:
A boundary scan chain for stacked memory. An embodiment of a memory device includes a system element and a memory stack including one or more memory die layers, each memory die layer including input-output (I/O) cells and a boundary scan chain for the I/O cells. A boundary scan chain of a memory die layer includes a scan chain portion for each of the I/O cells, the scan chain portion for an I/O cell including a first scan logic multiplexer a scan logic latch, an input of the scan logic latch being coupled with an output of the first scan logic multiplexer, and a decoder to provide command signals to the boundary scan chain.
Public/Granted literature
- US20170169900A1 BOUNDARY SCAN CHAIN FOR STACKED MEMORY Public/Granted day:2017-06-15
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