- 专利标题: Printed circuit board assembly
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申请号: US15794121申请日: 2017-10-26
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公开(公告)号: US10347451B2公开(公告)日: 2019-07-09
- 发明人: Moon Jung Park , Gon Jae Lee
- 申请人: MANDO Corporation
- 申请人地址: KR Pyeongtaek-si, Gyeonggi-do
- 专利权人: MANDO CORPORATION
- 当前专利权人: MANDO CORPORATION
- 当前专利权人地址: KR Pyeongtaek-si, Gyeonggi-do
- 代理机构: Hauptman Ham, LLP
- 优先权: KR10-2016-0140195 20161026
- 主分类号: H01H37/76
- IPC分类号: H01H37/76 ; H01H85/055 ; H01H85/20 ; H01H85/36 ; H05K1/02 ; H01H37/04 ; H01H85/02
摘要:
A printed circuit board (PCB) assembly according to one embodiment of the present disclosure includes a first pad; a second pad disposed to be spaced apart from the first pad; and a thermal fuse provided with a first terminal and a second terminal which are each coupled to the first pad and the second pad by soldering. Here, a contact area between the first pad and the first terminal is smaller than that between the second pad and the second terminal.
公开/授权文献
- US20180114657A1 PRINTED CIRCUIT BOARD ASSEMBLY 公开/授权日:2018-04-26
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