Invention Grant
- Patent Title: Integrated circuit structure including power rail and tapping wire with method of forming same
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Application No.: US15389632Application Date: 2016-12-23
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Publication No.: US10347546B2Publication Date: 2019-07-09
- Inventor: Jia Zeng , Wenhui Wang , Xuelian Zhu , Jongwook Kye
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/532 ; H01L29/06 ; H01L29/08 ; H01L27/105 ; H01L27/108 ; H01L27/112 ; H01L21/84 ; H01L27/12 ; H01L23/485 ; H01L21/82 ; H01L21/8234 ; H01L27/088

Abstract:
The disclosure relates to integrated circuit (IC) structures with substantially T-shaped wires, and methods of forming the same. An IC structure according to the present disclosure can include a first substantially T-shaped wire including a first portion extending in a first direction, and a second portion extending in a second direction substantially perpendicular to the first direction; an insulator laterally abutting the first substantially T-shaped wire at an end of the first portion, opposite the second portion; and a pair of gates each extending in the first direction and laterally abutting opposing sidewalls of the insulator and the first portion of the substantially T-shaped wire.
Public/Granted literature
- US20180182675A1 INTEGRATED CIRCUIT STRUCTURE INCLUDING POWER RAIL AND TAPPING WIRE WITH METHOD OF FORMING SAME Public/Granted day:2018-06-28
Information query
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