发明授权
- 专利标题: Acoustic sensor integrated MEMS microphone structure and fabrication method thereof
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申请号: US15781364申请日: 2015-12-14
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公开(公告)号: US10349187B2公开(公告)日: 2019-07-09
- 发明人: Junkai Zhan , Mengjin Cai , Guanxun Qiu , Zonglin Zhou , Qinglin Song
- 申请人: Goertek Inc.
- 申请人地址: CN Shandong
- 专利权人: Goertek Inc.
- 当前专利权人: Goertek Inc.
- 当前专利权人地址: CN Shandong
- 代理机构: Alston & Bird LLP
- 优先权: CN201510891760 20151204
- 国际申请: PCT/CN2015/097310 WO 20151214
- 国际公布: WO2017/092074 WO 20170608
- 主分类号: H04R19/00
- IPC分类号: H04R19/00 ; H04R19/04 ; H04R31/00 ; B81B7/00 ; B81C1/00 ; B81B7/02
摘要:
An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.
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