公开(公告)号：US11417463B2

公开(公告)日：2022-08-16

申请号：US16643361

申请日：2017-09-05

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang ,  Qinglin Song ,  Debo Sun

IPC: H01F7/06 ,  H01F41/04 ,  H01F5/00 ,  H01F41/12

Abstract: Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

公开(公告)号：US10349187B2

公开(公告)日：2019-07-09

申请号：US15781364

申请日：2015-12-14

Applicant: Goertek Inc.

Inventor： Junkai Zhan ,  Mengjin Cai ,  Guanxun Qiu ,  Zonglin Zhou ,  Qinglin Song

IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  B81B7/02

Abstract: An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.

公开(公告)号：US10246323B2

公开(公告)日：2019-04-02

申请号：US15559407

申请日：2015-12-15

Applicant: Goertek, Inc.

Inventor： Mengjin Cai ,  Qinglin Song

IPC: H01L21/76 ,  B81C1/00

Abstract: A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.

公开(公告)号：US20180086631A1

公开(公告)日：2018-03-29

申请号：US15559407

申请日：2015-12-15

Applicant: Goertek, Inc.

Inventor： Mengjin Cai ,  Qinglin Song

IPC: B81C1/00

CPC classification number: B81C1/00047 ,  B81B2201/0264 ,  B81C1/00079 ,  B81C1/00158 ,  B81C1/00269 ,  B81C1/00555

Abstract: A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.

公开(公告)号：US11099467B2

公开(公告)日：2021-08-24

申请号：US16483156

申请日：2017-02-06

Applicant: GOERTEK INC.

Inventor： Zhe Wang ,  Quanbo Zou ,  Qinglin Song ,  Jialiang Yan ,  Yujing Lin ,  Xiaoyang Zhang

IPC: G03B21/20 ,  G02B26/08 ,  G02B26/10

Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.