Invention Grant
- Patent Title: Acoustic sensor integrated MEMS microphone structure and fabrication method thereof
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Application No.: US15781364Application Date: 2015-12-14
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Publication No.: US10349187B2Publication Date: 2019-07-09
- Inventor: Junkai Zhan , Mengjin Cai , Guanxun Qiu , Zonglin Zhou , Qinglin Song
- Applicant: Goertek Inc.
- Applicant Address: CN Shandong
- Assignee: Goertek Inc.
- Current Assignee: Goertek Inc.
- Current Assignee Address: CN Shandong
- Agency: Alston & Bird LLP
- Priority: CN201510891760 20151204
- International Application: PCT/CN2015/097310 WO 20151214
- International Announcement: WO2017/092074 WO 20170608
- Main IPC: H04R19/00
- IPC: H04R19/00 ; H04R19/04 ; H04R31/00 ; B81B7/00 ; B81C1/00 ; B81B7/02

Abstract:
An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.
Public/Granted literature
- US20180359571A1 ACOUSTIC SENSOR INTEGRATED MEMS MICROPHONE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2018-12-13
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