Invention Grant
- Patent Title: Nonwoven joint tape having low moisture expansion properties and method for using same
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Application No.: US15699800Application Date: 2017-09-08
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Publication No.: US10352050B2Publication Date: 2019-07-16
- Inventor: Paul H. Neill , Salvatore C. Immordino , Richard B. Stevens , Charles J. Miller
- Applicant: United States Gypsum Company
- Applicant Address: US IL Chicago
- Assignee: United States Gypsum Company
- Current Assignee: United States Gypsum Company
- Current Assignee Address: US IL Chicago
- Agency: Leydig, Voit & Mayer, Ltd.
- Agent Philip T. Petti; Pradip K. Sahu
- Main IPC: E04F19/06
- IPC: E04F19/06 ; D04H1/58 ; D04H13/00 ; E04F21/00 ; E04F13/076 ; D04H1/4218 ; D04H1/425 ; D04H1/435 ; D04H1/4382 ; C09J7/21

Abstract:
The invention is directed to a joint tape for finishing a joint between boards having a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards having the steps of (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.
Public/Granted literature
- US20170370112A1 NONWOVEN JOINT TAPE HAVING LOW MOISTURE EXPANSION PROPERTIES AND METHOD FOR USING SAME Public/Granted day:2017-12-28
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