A stand assembly for an electronic device includes a neck portion with a first end that holds and extends from the electronic device, a spine portion that is coupled via a joint structure to a second end of the neck portion, the joint structure being configured to provide a first rotational degree of freedom of the neck portion with respect to the spine portion, and one or more interconnect wires. The one or more interconnect wires include a first wire portion, a second wire portion and a third wire portion, the first wire portion being routed through an interior of the neck portion, the second wire portion being routed along a surface of the spine portion, and the third wire portion being routed though the joint structure from the surface of the spine portion to the interior of the neck portion.