Invention Grant
- Patent Title: Asymmetric chip-to-chip interconnect
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Application No.: US15431421Application Date: 2017-02-13
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Publication No.: US10353668B2Publication Date: 2019-07-16
- Inventor: Timothy M. Hollis
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G06F5/06
- IPC: G06F5/06 ; G06F13/38 ; G06F13/42 ; H04L12/40 ; H04L25/02 ; H04L29/08

Abstract:
Methods and apparatuses to transfer data between a first device and a second device are disclosed. In various embodiments, an apparatus includes a first device and a second device. The first device includes at least one first non-differential transmitter coupled to a first channel, at least one second non-differential transmitter coupled to a second channel, and at least one differential receiver to receive a data bit and its complement on the first and second channels in parallel. The second device includes at least one first non-differential receiver coupled to the first channel, at least one second non-differential receiver coupled to the second channel, and at least one differential transmitter to transmit a data bit and its complement on the first and second channels in parallel. Other methods and apparatuses are disclosed.
Public/Granted literature
- US20170177301A1 ASYMMETRIC CHIP-TO-CHIP INTERCONNECT Public/Granted day:2017-06-22
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