Invention Grant
- Patent Title: Omnidirectional roughness algorithm for topographic signature analysis of lunar craters
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Application No.: US15367158Application Date: 2016-12-01
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Publication No.: US10354398B2Publication Date: 2019-07-16
- Inventor: Zhanchuan Cai , Wei Cao
- Applicant: Macau University of Science and Technology
- Applicant Address: CN Macau
- Assignee: Macau University of Science and Technology
- Current Assignee: Macau University of Science and Technology
- Current Assignee Address: CN Macau
- Agency: Eagle IP Limited
- Agent Jacqueline C. Lui
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/40 ; G06K9/46

Abstract:
A method executed by a computer system to construct an omnidirectional roughness (OR) map of a lunar crater based on a data set of a digital elevation model (DEM) of surface textures of the lunar crater is provided. The method includes setting a center and a first point of the data set, selecting a moving window, utilizing a one point-to-point step when the moving window slides over the DEM, calculating a morphological surface roughness (MSR) that detects a vertical roughness of the lunar crater, calculating a topographic frequency coefficient (TFC) that detects a horizontal roughness of the lunar crater, constructing the OR map, and displaying the OR map to show a surface roughness of the lunar crater.
Public/Granted literature
- US20180158202A1 Omnidirectional Roughness Algorithm for Topographic Signature Analysis of Lunar Craters Public/Granted day:2018-06-07
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