Invention Grant
- Patent Title: Hybrid magnetic material structures for electronic devices and circuits
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Application No.: US15283350Application Date: 2016-10-01
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Publication No.: US10354786B2Publication Date: 2019-07-16
- Inventor: Donald S. Gardner , Gerhard Schrom , Edward A. Burton
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01F1/147 ; H01F10/06 ; H01F27/255 ; H01F27/28 ; H01F41/04 ; H01F41/16 ; H01F41/32 ; H01L25/18 ; H01L49/02 ; H05K3/00 ; H01F17/00 ; H01F27/36 ; H05K1/16 ; H01F41/26 ; H01F41/18

Abstract:
Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.
Public/Granted literature
- US20180096764A1 HYBRID MAGNETIC MATERIAL STRUCTURES FOR ELECTRONIC DEVICES AND CIRCUITS Public/Granted day:2018-04-05
Information query
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